Solder Paste Types 3, 4, and 5

The different types of solder paste are typically classified based on their particle size and composition. Types 3, 4, and 5 solder pastes are variations of solder pastes with distinct characteristics:

  • Particle Size: Type 3 solder paste has a relatively large particle size, typically in the range of 45 to 75 micrometers (μm). These larger particles make it suitable for applications where a larger gap between components and the circuit board needs to be filled.
  • Applications: Type 3 solder paste is commonly used in applications that involve components with a larger standoff height or for processes that require a higher volume of solder paste deposition.

  • Particle Size: Type 4 solder paste has a medium particle size, usually ranging from 25 to 45 micrometers (μm). It strikes a balance between finer and coarser pastes, making it versatile for various assembly scenarios.
  • Applications: Type 4 solder paste is a general-purpose solder paste that can be used in a wide range of applications, including surface mount technology (SMT) and through-hole component soldering.

  • Particle Size: Type 5 solder paste features fine particles, typically ranging from 15 to 25 micrometers (μm). The smaller particle size allows for finer pitch and high-density surface mount component assembly.
  • Applications: Type 5 solder paste is used in applications that require precise solder deposits, such as fine-pitch components, microelectronics, and miniaturized devices. It’s suitable for advanced surface mount technology where component placement is closely spaced.

Selecting the appropriate solder paste type depends on the specific requirements of the electronics assembly process, including component size, spacing, and manufacturing equipment capabilities. Using the right solder paste type ensures reliable solder joints and high-quality electronic assemblies. We work closely with solder paste suppliers to determine the most suitable type of solder paste for their particular application.