Different SMD Component Package Sizes

A Surface Mount Device (SMD) refers to an electronic component designed for surface-mount technology (SMT), a method where components are mounted or placed directly onto the surface of printed circuit boards (PCBs). Unlike through-hole components, which have leads inserted into drilled holes, SMDs are soldered directly to the PCB’s surface, allowing for more compact and densely populated circuits.

Key features of SMDs include:

  • Small size: They are much smaller than traditional through-hole components, making them ideal for miniaturized electronic devices.
  • No leads or short leads: SMDs typically have either no leads or short leads that connect to the PCB surface.
  • High efficiency: They enable faster assembly and better electrical performance due to shorter interconnects.

SMDs are commonly used in modern electronics, such as smartphones, computers, and other compact devices.

Contents

  1. SMD package sizes for resistors, capacitors, inductors, and diodes
  2. Comparison of different SMD components
  3. Surface-mount PCB connectors
  4. Common SMD Tantalum capacitor sizes
  5. Small outline transistor package types
  6. Integrated circuit SMD packages

SMD package sizes for resistors, capacitors, inductors, and diodes

SMD package sizes for resistors, capacitors, inductors, and diodes indicate the physical dimensions of the components. These sizes affect placement, thermal management, and electrical characteristics, with smaller packages suited for compact designs and automated assembly processes.

 

Chip package type Dimensions in mm dimensions in inches
01005 0.4 x 0.2 0.016 x 0.008
015015 0.38 x 0.38 0.014 x 0.014
0201 0.6 x 0.3 0.02 x 0.01
0202 0.5 x 0.5 0.019 x 0.019
02404 0.6 x 1.0 0.02 x 0.03
0303 0.8 x 0.8 0.03 x 0.03
0402 1.0 x 0.5 0.04 x 0.02
0603 1.5 x 0.8 0.06 x 0.03
0805 2.0 x 1.3 0.08 x 0.05
1008 2.5 x 2.0 0.10 x 0.08
1111 2.8 x 2.8 0.11 x 0.11
1206 3.0 x 1.5 0.12 x 0.06
1210 3.2 x 2.5 0.125 x 0.10
1806 4.5 x 1.6 0.18 x 0.06
1808 4.5 x 2.0 0.18 x 0.07
1812 4.6 x 3.0 0.18 x 0.125
1825 4.5 x 6.4 0.18 x 0.25
2010 5.0 x 2.5 0.20 x 0.10
2725 6.9 x 6.3 0.27 x 0.25
2920 7.4 x 5.1 0.29 x 0.20

Comparison of different SMD components

It’s essential to choose the appropriate SMD components that not only fit your design but also effectively fulfill their intended purpose. The table below compares commonly used SMD components.

 

Packages Dimensions (mm) Applications Component Type Number of pins
SMA 3.56 x 2.92 RF and microwaves devices Diode 2
DO-214 5.30 x 6.10 Power rectification diodes Diode 2
DO-213AA 4.57 x 3.94 Small signal transistors and diodes Diode 2
SMC 5.94 x 5.41 Integrated circuits, resistors, and capacitors Diode 2
TO-277 3.85 x 3.85 Power MOSFETs and voltage regulators MOSFET 3
MBS 2.60 x 1.90 Switching diodes and high-density integrated circuits Diode 2
SOD-123 2.60 x 1.90 Small signal diodes and transistors Diode 2
0603 1.6 x 0.8 Consumer, automotive, and industrial equipment Resistors, capacitors, and inductors 2
0805 2.0 x 1.25 Consumer, automotive, and industrial equipment Resistors, capacitors, and inductors 2
1206 3.2 x 1.6 Consumer, automotive, and industrial equipment Resistors, capacitors, and inductors 2

Surface-mount PCB connectors

No electronic project is complete without a suitable connector. In surface-mount technology, SMA and SMB connectors are commonly used for board assembly. SMA stands for Sub-Miniature Version A, while SMB stands for Sub-Miniature Version B.

 

Type Properties Applications
SMA
  1. Semi-precision
  2. Coaxial RF connector
  3. Impedance 50Ω
  4. Electrical use from DC (0GHz) to 12GHz, but extended to 18GHz and 26.5GHz
  1. Microwave Systems
  2. Hand-held radio
  3. Mobile telephone antennas
  4. WiFi antenna systems
SMB
  1. Semi-precision
  2. Coaxial RF connector
  3. Impedance 50Ω or 75Ω
  4. Electrical use from DC (0GHz) to 4GHz
  5. Smaller than SMA
  1. Telecommunications
  2. Test equipment
  3. Instrumentation
  4. GPS

Common SMD Tantalum capacitor sizes

Tantalum capacitors offer high capacitance in a compact package, making them ideal for applications requiring high capacitance and low current.

 

package type Dimensions in mm EIA standard
Size A 3.2 x 1.6 x 1.6 EIA 3216-18
Size B 3.5 x 2.8 x 1.9 EIA 3528-21
Size C 6.0 x 3.2 x 2.2 EIA 6032-28
Size D 7.3 x 4.3 x 2.4 EIA 7343-31
Size E 7.3 x 4.3 x 4.1 EIA 7343-43

Small outline transistor package types

A Small Outline Transistor (SOT) is a type of discrete surface-mount transistor commonly utilized in consumer electronics. Below are some frequently used SOT packages.

 

package type Dimensions in mm Terminal
SOT-23 3 x 1.75 x 1.3 3
SOT-223 6.7 x 3.7 x 1.8 4
SOT-323 2.1 x 2.1 x 0.9 4
SOT-523 1.6 x 1.6 x 0.7 4

Integrated circuit SMD packages

ICs are housed in packages to ensure protection. Below, we’ll explore various important IC packages, their properties, and their applications.

 

package Type Properties Application
SOIC
  1. Small outline integrated circuit
  2. Surface-mount equivalent of the classic through-hole DIP (Dual-Inline Package)
  1. Standard package for logic IC
TSSOP
  1. Thin shrink small outline package
  2. Rectangular surface mount
  3. Plastic integrated circuit (IC) package
  4. Gull-wing leads
  1. Analog amplifiers
  2. Controllers and drivers
  3. Logic Devices
  4. Memory Devices
  5. RF/Wireless
  6. Disk drives
QFP
  1. Quad flat package
  2. Easiest option for high pin-count components
  3. Easy to inspect by AOI
  4. Assembled with standard reflow soldering
  1. Microcontrollers
  2. Multi-channel codecs
QFN
  1. Quad flat no-lead
  2. Electrical contacts do not come out of the component
  3. Smaller than QFP
  4. Require extra attention in PCB assembly
  1. Microcontrollers
  2. Multi-channel codecs
PLCC
  1. Plastic leaded chip carrier
  2. Allow components to be directly mounted on the PCB
  1. Prototype PCB assembly
BGA
  1. Ball grid array
  2. Most complex
  3. High pin-count components are below silicon IC
  4. Requires reflow soldering for PCB assembly
    1. High-sped microprocessor
    2. Field programming gate array (FPGA)
POP
  1. Package-on package technology
  2. Stacked on the top of others
  1. Used for memory devices and microprocessors
  2. High-speed design, HDI design

SMD components enable a more compact design by reducing form factor and manufacturing costs, while optimizing board space efficiently. They are often preferable to through-hole components for creating sleek, compact, high-speed, or HDI boards.

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