A method of assembling electronic components on the surface of a PCB, as opposed to through-hole technology.

A PCB assembly method where component leads pass through holes in the board and are soldered on the opposite side.

A conductive path on the PCB that connects electronic components.

A protective layer applied to the PCB to prevent solder from spreading to unwanted areas during soldering.

A printed layer on the PCB used for component labeling and reference designators.

Standard files used to describe PCB layouts and designs for manufacturing.

The layer on a PCB where copper traces are etched to create electrical connections.

The designated area on the PCB where a specific electronic component is mounted.

A template used to precisely apply solder paste to the PCB during SMT assembly.

A type of integrated circuit packaging with solder balls arranged in a grid on the underside.

Plated holes that connect different layers of a multilayer PCB.

A conductive area on the PCB surface where components are soldered.

The distance between the centers of two adjacent components or pads.

Software verification to ensure the PCB design adheres to manufacturing constraints and specifications.

A specific layer of a multilayer PCB responsible for carrying electrical signals.

A large copper area on the PCB dedicated to providing a stable ground reference.

A layer on the PCB dedicated to distributing power to components.

A list of all components required for a PCB assembly, including part numbers and quantities.

An automated machine used in SMT assembly to accurately place surface-mount components on the PCB.

A process that melts solder paste to create electrical connections between components and PCB pads.

The thickness of the stencil used to apply solder paste, affecting the volume of paste deposited.

A mixture of solder particles and flux used to create solder joints during reflow soldering.

A directive restricting the use of certain hazardous materials in electronic products.

The sudden discharge of static electricity that can damage electronic components.

Reference marks on the PCB used by pick-and-place machines for precise component alignment.

The dimensions of a pad, including its width and length, which affect soldering and component compatibility.

The process of combining multiple PCBs onto a single larger board for efficient manufacturing.

A via that connects an outer layer to an inner layer of a multilayer PCB but doesn’t extend through all layers.

Undesired electromagnetic interference between adjacent traces or components.

The resistance to the flow of alternating current in a PCB trace, important for signal integrity.

The acceptable variation from specified values in PCB manufacturing.

A common type of fiberglass-reinforced epoxy laminate used as PCB substrate material.

A property of PCB substrate materials that affects signal propagation speed.

A process of applying a thin layer of gold to PCB pads or connectors for corrosion resistance and improved conductivity.

A pattern of copper traces designed to make soldering to a pad easier.

A standards organization for PCB design and manufacturing.

The thickness of the copper layer on a PCB, typically measured in ounces per square foot (oz/ft²).

The ring of copper surrounding a hole in a PCB pad.

A method of soldering through-hole components by immersing the assembly in molten solder.

A popular PCB design software used for schematic capture and layout.

A pair of traces on a PCB that carry complementary signals to reduce noise and crosstalk.

A machine that cuts individual PCBs from a larger panel after assembly.

The opening in the stencil through which solder paste is deposited onto the PCB.

Strategies and design considerations to control heat generated by components on a PCB.

A type of edge-plated hole used for mechanical stability and improved grounding.

The process of connecting a high-pin-count component to the rest of the PCB.

A list of electrical connections between components in a PCB design.

The process of repairing or replacing BGA components on a PCB.

A test pattern used to verify the continuity and functionality of PCB traces and connections.